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dc.contributor.authorChin, Aen_US
dc.contributor.authorWu, YHen_US
dc.contributor.authorChen, SBen_US
dc.contributor.authorLiao, CCen_US
dc.contributor.authorChen, WJen_US
dc.date.accessioned2014-12-08T15:27:03Z-
dc.date.available2014-12-08T15:27:03Z-
dc.date.issued2000en_US
dc.identifier.isbn0-7803-6306-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19275-
dc.identifier.urihttp://dx.doi.org/10.1109/VLSIT.2000.852751en_US
dc.description.abstractHigh quality La2O3 and Al2O3 are fabricated with EOT of 4.8 and 9.6 Angstrom, leakage current of 0.06 and 0.4A/cm(2) and D-it of both 3x10(10) eV(-1)/cm(2), respectively. The high K is further evidenced from high MOSFET's I-d and g(m) with low I-off Good SILC and Q(BD) are obtained and comparable with. SiO2. The low EOT is due to the high thermodynamic stability in contact with Si and stable after H-2 annealing up to 550 degrees C.en_US
dc.language.isoen_USen_US
dc.titleHigh quality La2O3 and Al2O3 gate dielectrics with equivalent oxide thickness 5-10 angstromen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/VLSIT.2000.852751en_US
dc.identifier.journal2000 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERSen_US
dc.citation.spage16en_US
dc.citation.epage17en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088359300006-
Appears in Collections:Conferences Paper


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