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dc.contributor.authorChiang, LPen_US
dc.contributor.authorTsai, CWen_US
dc.contributor.authorWang, Ten_US
dc.contributor.authorLiu, UCen_US
dc.contributor.authorWang, MCen_US
dc.contributor.authorHsia, LCen_US
dc.date.accessioned2014-12-08T15:27:03Z-
dc.date.available2014-12-08T15:27:03Z-
dc.date.issued2000en_US
dc.identifier.isbn0-7803-6306-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19276-
dc.identifier.urihttp://dx.doi.org/10.1109/VLSIT.2000.852798en_US
dc.description.abstractEnhanced hot carrier degradation is observed in DTMOS-like operation mode. This phenomenon is attributed to Auger recombination assisted hot electron process. Measured hot electron gate current and light emission spectrum in nMOSFETs provide evidence that the high-energy tail of channel electrons is increased by the application of a positive substrate bias. As opposed to conventional hot carrier degradation, the Auger enhanced degradation exhibits positive temperature dependence and is more significant at low drain bias.en_US
dc.language.isoen_USen_US
dc.titleAuger recombination enhanced hot carrier degradation in nMOSFETs with positive substrate biasen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/VLSIT.2000.852798en_US
dc.identifier.journal2000 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERSen_US
dc.citation.spage132en_US
dc.citation.epage133en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088359300052-
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