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dc.contributor.authorChiou, JCen_US
dc.contributor.authorLin, YCen_US
dc.date.accessioned2014-12-08T15:27:07Z-
dc.date.available2014-12-08T15:27:07Z-
dc.date.issued1999en_US
dc.identifier.isbn0-8194-3494-9en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19367-
dc.identifier.urihttp://dx.doi.org/10.1117/12.368436en_US
dc.description.abstractA newly developed micromirror device that possesses two rotational (tilt) and one displacement (piston) degrees of freedom has been designed and fabricated by using surface micromachining technology. The device consists of a micromirror, four vertical thermal-actuator arrays and four torsion bars that connect the mirror and the actuator. The vertical thermal actuator has the capability to elevate from its origin position. To demonstrate the feasibility of the vertical thermal actuator, various layouts and sizes has been designed. The present device was fabricated through the Multi-User MEMS process (MUMPs). When the controlled signal is applied to any two adjacent thermal-actuator arrays of the device, the remain two thermal actuator arrays and torsion bars will act as the supporting beams that allow the micromirror to experience rolling or pitching motion. On the other hand, by applying controlled signals to all four thermal-actuator arrays synchronously, the micromirror would elevate vertically. Note that different rolling or pitching angle of the micromirror can be archived by designing the locations of the torsion bars with vertical thermal actuators. Through the process, a compact, extremely light in weight, potentially low cost, and operating in very low voltage (<10V) micromirror device with various applications can be obtained.en_US
dc.language.isoen_USen_US
dc.subjectmicromirroren_US
dc.subjectthermal actuatoren_US
dc.subjectrolling and pitching degrees of freedomen_US
dc.subjectMEMSen_US
dc.subjectMUMPsen_US
dc.titleA micromirror device with tilt and piston motionsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.368436en_US
dc.identifier.journalDESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICSen_US
dc.citation.volume3893en_US
dc.citation.spage298en_US
dc.citation.epage303en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:000084509900030-
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