完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lor, WB | en_US |
dc.contributor.author | Chu, HS | en_US |
dc.date.accessioned | 2014-12-08T15:27:11Z | - |
dc.date.available | 2014-12-08T15:27:11Z | - |
dc.date.issued | 1999 | en_US |
dc.identifier.isbn | 1-85312-694-2 | en_US |
dc.identifier.issn | 1466-7266 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/19409 | - |
dc.description.abstract | This article numerically analyzes the heat conduction in a two layers composite media under an initial temperature pulse emanating from the exterior surface of one layer. The thermal wave model, which allows for both a transient heat flux and a finite speed of propagation, predicts significantly different results with those predicted by the Fourier's diffusion model at small time scale. The differences between the two heat transfer models diminish with increasing time. The thermal wave model further demonstrates that the internal reflection and transmission occur at the contact surface of the dissimilar material. To consider the thermal resistance at the contact interface, an interfacial-layer model (ILM) and a radiation heat flux model at the interface based on acoustic mismatch model (AMM) or diffuse mismatch model (DMM) are employed. Analysis results indicate that the thermal boundary resistance significantly influences the wave pattern and strength. The reflection-transmission-combination phenomena strongly varies with the two layers properties ratio, skin depth, and the interface condition. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Effect of interface thermal resistance on thermal wave phenomena in a two-layer composite media | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | COMPUTATIONAL METHODS IN CONTACT MECHANICS IV | en_US |
dc.citation.spage | 487 | en_US |
dc.citation.epage | 496 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000085321700047 | - |
顯示於類別: | 會議論文 |