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dc.contributor.authorCheng, HCen_US
dc.contributor.authorHuang, CYen_US
dc.contributor.authorLin, JWen_US
dc.contributor.authorKung, JJHen_US
dc.date.accessioned2014-12-08T15:27:19Z-
dc.date.available2014-12-08T15:27:19Z-
dc.date.issued1998en_US
dc.identifier.isbn0-7803-4306-9en_US
dc.identifier.urihttp://hdl.handle.net/11536/19579-
dc.description.abstractIn this paper, hydrogenated amorphous silicon and polycrystalline silicon thin film transistors have been stressed with various conditions including DC and AC. The charge trapping and defect state creation are the two mechanisms to degrade the transfer characteristics of the TFTs. For a-Si.H TFTs, the charge trapping occurs at high silicon content of silicon nitride (SiNx) gate dielectrics or performs at high gate electrical field. Defect stale creation dominates at low hydrogen concentration in a-Si:H. At the performance of AC signal, the degradation of transfer curves is associated with bias, frequency, and duty cycle. The characteristics of a-Si:PI TFTs shift more with increasing bias voltage and duty cycle. For the frequency effect, the transfer characteristics of a-Si:H TFTs decrease with increasing AC frequency under negative AC signal stress, however, they are independent of the frequency under positive AC signal stress.en_US
dc.language.isoen_USen_US
dc.titleThe reliability of amorphous silicon thin film transistors for LCD under DC and AC stressesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGSen_US
dc.citation.spage834en_US
dc.citation.epage837en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000080928800224-
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