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dc.contributor.authorMei, YJen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorSheu, JDen_US
dc.contributor.authorYeh, WKen_US
dc.contributor.authorPan, FMen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2014-12-08T15:27:37Z-
dc.date.available2014-12-08T15:27:37Z-
dc.date.issued1996en_US
dc.identifier.isbn1-55899-330-4en_US
dc.identifier.issn0886-7860en_US
dc.identifier.urihttp://hdl.handle.net/11536/19885-
dc.description.abstractSelective tungsten chemical vapor deposition (W-CVD) is one of the most attractive technique for filling deep submicron contact hole and via hole for the ULSI application. In this work, we firstly find out the anomalous selective W growth for the contact hole. The tungsten only nucleates from the side ring of the contact hole bottom. Several predeposition treatments prior to W growth can improve this anomalous feature and excellently selective W growth can be achieved. Auger electron spectroscopy (AES) is utilized to investigate the interface of Si/W. A model has been proposed to explain this anomalous selective tungsten growth.en_US
dc.language.isoen_USen_US
dc.titleAnomalous selective tungsten growth by chemical vapor depositionen_US
dc.typeProceedings Paperen_US
dc.identifier.journalADVANCED METALLIZATION FOR FUTURE ULSIen_US
dc.citation.volume427en_US
dc.citation.spage399en_US
dc.citation.epage405en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996BG72C00054-
Appears in Collections:Conferences Paper