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學術出版;;Publications
會議論文;;Conferences Paper
Performance of MOCVD tantalum nitride diffusion barrier for copper metallization
Performance of MOCVD tantalum nitride diffusion barrier for copper metallization
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A1995BE44J00013.pdf
(269.67 KB)
Date
1995
Authors
Sun, SC
Tsai, MH
Tsai, CE
Chiu, HT
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Volume Title
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DOI
10.1109/VLSIT.1995.520844
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http://dx.doi.org/10.1109/VLSIT.1995.520844
https://ir.lib.nycu.edu.tw/handle/11536/20046
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會議論文;;Conferences Paper
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