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dc.contributor.authorXuan, Rongen_US
dc.contributor.authorKuo, Wei-Hongen_US
dc.contributor.authorHu, Chih-Weien_US
dc.contributor.authorLin, Suh-Fangen_US
dc.contributor.authorChen, Jenn-Fangen_US
dc.date.accessioned2014-12-08T15:28:19Z-
dc.date.available2014-12-08T15:28:19Z-
dc.date.issued2012-09-10en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4752113en_US
dc.identifier.urihttp://hdl.handle.net/11536/20479-
dc.description.abstractThis paper presents an approach in fabricating normally off AlGaN/GaN high electron mobility transistors (HEMTs). The fabrication technique was based on the carbon-doped GaN epitaxy layers on silicon substrate and the nano rod structure of the gate region in AlGaN/GaN HEMTs. Using this method, the threshold voltage of AlGaN/GaN HEMTs can be shifted from -2 V in a conventional depletion-mode (D-mode) AlGaN/GaN HEMT to 2 V in an enhancement-mode (E-mode) AlGaN/GaN HEMT. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4752113]en_US
dc.language.isoen_USen_US
dc.titleEnhancing threshold voltage of AlGaN/GaN high electron mobility transistors by nano rod structure: From depletion mode to enhancement modeen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4752113en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume101en_US
dc.citation.issue11en_US
dc.citation.epageen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000309329300038-
dc.citation.woscount2-
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