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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorYu, Shao-Mingen_US
dc.contributor.authorHwang, Chih-Hongen_US
dc.contributor.authorKuo, Yi-Tingen_US
dc.date.accessioned2014-12-08T15:28:22Z-
dc.date.available2014-12-08T15:28:22Z-
dc.date.issued2008-09-01en_US
dc.identifier.issn1569-8025en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10825-008-0192-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/20524-
dc.description.abstractIn this study, a three-dimensional electro-thermal time-domain simulation is developed for dynamic thermal analysis of Phase change memories (PCMs). The geometry effects of the GeSbTe (GST) materials and the TiN heater are explored through a series of numerical examinations. It is found that the contact size of the GST significantly alters the maximum temperature of the PCMs, compared with the height of the GST films. The heater's aspect ratio also dominates the maximum temperature of the GST material, and the effect of the heater's thickness on the temperature is more evident than its height. One conformal bi-layer GST structure with different electric and thermal conductivities on the GST layers is examined for different applied currents to extract the curve of resistances versus applied currents.en_US
dc.language.isoen_USen_US
dc.subjectPhase change memoriesen_US
dc.subjectGeSbTe materialen_US
dc.subjectGeometry effectsen_US
dc.subjectTemperatureen_US
dc.subjectNumerical simulationen_US
dc.titleTemperature dependence on the contact size of GeSbTe films for phase change memoriesen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s10825-008-0192-8en_US
dc.identifier.journalJOURNAL OF COMPUTATIONAL ELECTRONICSen_US
dc.citation.volume7en_US
dc.citation.issue3en_US
dc.citation.spage138en_US
dc.citation.epage141en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000208473800011-
dc.citation.woscount4-
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