Full metadata record
DC FieldValueLanguage
dc.contributor.authorHung, Jung-Chungen_US
dc.contributor.authorTsai, Yen-Pinen_US
dc.contributor.authorHung, Chinghuaen_US
dc.date.accessioned2014-12-08T15:28:25Z-
dc.date.available2014-12-08T15:28:25Z-
dc.date.issued2013-01-01en_US
dc.identifier.issn0141-6359en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.precisioneng.2012.06.002en_US
dc.identifier.urihttp://hdl.handle.net/11536/20573-
dc.description.abstractA new apparatus for an ultrasonic vibration-assisted glass hot embossing process has been developed. The upper die constitutes the ultrasonic vibrating device, and a cooler is provided to protect the transducer from the high operating temperatures. An ultrasonic horn originally designed for use at room temperature was modified to ensure correct operation of ultrasonic vibrating device for high temperature use. Because the load cell is located inside a vacuum chamber, the detection of the force applied to the glass during the forming process is not significantly impacted by external forces, and thus, a precise force history of the forming glass can be obtained. Flat hot embossing experiments were performed to investigate the effect of ultrasonic vibration on the amount of force required during forming, and Fresnel structure hot embossing experiments were then conducted to investigate the improvement in molding accuracy gained through ultrasonic vibration. The experimental results are taken to validate the manufacturing potential of the developed apparatus and the improvement in formability achieved by applying ultrasonic vibration. (c) 2012 Elsevier Inc. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectUltrasonic vibrationen_US
dc.subjectGlass hot embossingen_US
dc.titleDevelopment of a new apparatus for ultrasonic vibration-assisted glass hot embossing processen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.precisioneng.2012.06.002en_US
dc.identifier.journalPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGYen_US
dc.citation.volume37en_US
dc.citation.issue1en_US
dc.citation.spage222en_US
dc.citation.epage227en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000311260200020-
dc.citation.woscount0-
Appears in Collections:Articles


Files in This Item:

  1. 000311260200020.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.