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dc.contributor.authorZheng, Zhi-Weien_US
dc.contributor.authorKu, Teng-Chiehen_US
dc.contributor.authorLiu, Mingen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:28:53Z-
dc.date.available2014-12-08T15:28:53Z-
dc.date.issued2012-11-26en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4768700en_US
dc.identifier.urihttp://hdl.handle.net/11536/20873-
dc.description.abstractPoor ohmic contact by Fermi-level pinning to valence band (EV) edge is one of the major challenges for germanium (Ge) n-type metal-oxide-semiconductor field-effect transistor (nMOSFET). Using low work-function rare-earth ytterbium (Yb), good ohmic contact on n-type Ge with alleviated Fermi-level pinning was demonstrated. Such ohmic behavior depends strongly on the germanide formation condition, where much degraded ohmic contact at 600 degrees C rapid thermal annealing is due to the lower Yb/Ge composition found by energy-dispersive x-ray spectroscopy. The ohmic behavior of Yb-germanide/n-type-Ge has high potential for future high-performance Ge nMOSFET application. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4768700]en_US
dc.language.isoen_USen_US
dc.titleOhmic contact on n-type Ge using Yb-germanideen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4768700en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume101en_US
dc.citation.issue22en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000311967000081-
dc.citation.woscount2-
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