Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

doi:10.1016/j.microrel.2012.07.029

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DC 欄位	值	語言
dc.contributor.author	Tu, K. N.	en_US
dc.contributor.author	Hsiao, Hsiang-Yao	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2014-12-08T15:29:38Z	-
dc.date.available	2014-12-08T15:29:38Z	-
dc.date.issued	2013-01-01	en_US
dc.identifier.issn	0026-2714	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.microrel.2012.07.029	en_US
dc.identifier.uri	http://hdl.handle.net/11536/21287	-
dc.description.abstract	As microelectronic industry develops 3D IC on the basis of through-Si-vias (TSV) technology, the processing and reliability of microbumps, which are used to interconnect the stacking chips, is being actively investigated. Due to the reduction in size of microbumps, the diameter is about one order of magnitude smaller than that of flip chip solder joints, and the volume is 1000 times smaller. Its microstructure and in turn its properties will be anisotropic because the number of grains in a microbump becomes very small. Its statistical failure will have a wide distribution because of anisotropy, including early failure. This review addresses this issue and the remedy. (C) 2012 Elsevier Ltd. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.title	Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1016/j.microrel.2012.07.029	en_US
dc.identifier.journal	MICROELECTRONICS RELIABILITY	en_US
dc.citation.volume	53	en_US
dc.citation.issue	1	en_US
dc.citation.spage	2	en_US
dc.citation.epage	6	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000314258600002	-
dc.citation.woscount	10	-
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