完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.author | Wang, Chao-Lung | en_US |
dc.contributor.author | Lee, I-Che | en_US |
dc.contributor.author | Wu, Chun-Yu | en_US |
dc.contributor.author | Cheng, Yu-Ting | en_US |
dc.contributor.author | Yang, Po-Yu | en_US |
dc.contributor.author | Cheng, Huang-Chung | en_US |
dc.date.accessioned | 2014-12-08T15:29:55Z | - |
dc.date.available | 2014-12-08T15:29:55Z | - |
dc.date.issued | 2013-02-01 | en_US |
dc.identifier.issn | 0040-6090 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.tsf.2012.09.048 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/21456 | - |
dc.description.abstract | High-performance polycrystalline silicon thin-film transistors (TFTs) using an excimer laser crystallization of the prepatterned channel layer on the bottom-gate (BG) structure were fabricated to exhibit a field-effect mobility as high as 339 cm(2)/V s and an on/off current ratio of 9.5x10(7) with respect to 102 cm(2)/V s and 1.5x10(7) for the conventional top-gate (TG) TFTs, respectively. Such a superior performance is attributed to the cross-shaped grain boundary structure formed in the channel region owing to the two-dimensional location control of grain boundaries. Moreover, the prepatterned BG TFTs show better device-to-device uniformity than the conventional TG ones due to the manipulated grain boundaries. This technology is thus promising for the future applications of system-on-panel and three-dimension integrated circuits. (C) 2012 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Excimer laser crystallization (ELC) | en_US |
dc.subject | Polycrystalline silicon | en_US |
dc.subject | Prepatterned | en_US |
dc.subject | Thin-film transistors (TFTs) | en_US |
dc.title | High-performance polycrystalline silicon thin-film transistors prepared via the laser crystallization of the prepatterned channel layer on the bottom-gate structure | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.tsf.2012.09.048 | en_US |
dc.identifier.journal | THIN SOLID FILMS | en_US |
dc.citation.volume | 529 | en_US |
dc.citation.issue | en_US | |
dc.citation.spage | 421 | en_US |
dc.citation.epage | 425 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000315928000091 | - |
dc.citation.woscount | 0 | - |
顯示於類別: | 期刊論文 |