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dc.contributor.authorHuang, Yu-Chihen_US
dc.contributor.authorLin, Huan-Minen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2014-12-08T15:30:45Z-
dc.date.available2014-12-08T15:30:45Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4673-4841-6en_US
dc.identifier.issn2159-3523en_US
dc.identifier.urihttp://hdl.handle.net/11536/21973-
dc.description.abstractThe random access memory (RRAM) cells consisted with the Cu doped TiO2 film and both Pt inert electrodes has been purposed. Compared with the common conductive-bridging mode sample structure which have a Cu active electrode, a non-doped TiO2 film and a Pt inert electrode. "The Cu doped film with both inert electrodes sample exhibited the endurance of 1000 cycles more than the common ones of 400 cycles under the same operating conditions. Furthermore, the doped sample required lower setting voltage of -0.7V than the common ones of -1.5V. The differences in resistance resistive switching characteristics were possible caused by the amounts of Cu ions distribution and the forming of the conductive filaments in the TiO2 layers, according the results of the electrical characteristics measurements and the material analysis.en_US
dc.language.isoen_USen_US
dc.titleSuperior Resistive Switching Characteristics of Cu-TiO2 Based RRAM Cellen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE 2013 IEEE 5TH INTERNATIONAL NANOELECTRONICS CONFERENCE (INEC)en_US
dc.citation.spage236en_US
dc.citation.epage239en_US
dc.contributor.department電機學院zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000319409400074-
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