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dc.contributor.authorChen, Chien-Hungen_US
dc.contributor.authorLi, Yimingen_US
dc.contributor.authorChen, Chieh-Yangen_US
dc.contributor.authorChen, Yu-Yuen_US
dc.contributor.authorHsu, Sheng-Chiaen_US
dc.contributor.authorHuang, Wen-Tsungen_US
dc.contributor.authorChu, Sheng-Yuanen_US
dc.date.accessioned2014-12-08T15:31:00Z-
dc.date.available2014-12-08T15:31:00Z-
dc.date.issued2013-09-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2013.03.131en_US
dc.identifier.urihttp://hdl.handle.net/11536/22108-
dc.description.abstractIn this work, the FinFET HKMG MOS devices are fabricated on silicon wafer with p-substrate. The interface roughness between the SiGe and SiO2 is experimentally extracted and calculated as a function of root mean square by analysis of high resolution transmission electron microscopy. The surface-roughness dependent mobility model is then incorporated into device simulation to study the mobility of SiGe along (110) and (100) orientations of the devices. We further analyze four devices with different surface roughness along (100) and (100) orientations to demonstrate the influence of surface roughness on the total effective mobility. (C) 2013 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectMobilityen_US
dc.subjectFinFETen_US
dc.subjectInterface roughnessen_US
dc.subjectSilicon germaniumsen_US
dc.subjectDevice simulationen_US
dc.subjectOrientationsen_US
dc.titleMobility model extraction for surface roughness of SiGe along (110) and (100) Orientations in HKMG bulk FinFET devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.mee.2013.03.131en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume109en_US
dc.citation.issueen_US
dc.citation.spage357en_US
dc.citation.epage359en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000321229200090-
dc.citation.woscount2-
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