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dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorChang, Chia Huaen_US
dc.contributor.authorTang, Shih Hsuanen_US
dc.contributor.authorHai Dang Trinhen_US
dc.contributor.authorKuo, Chien I.en_US
dc.contributor.authorHsu, Ching Yien_US
dc.contributor.authorSu, Yung Hsuanen_US
dc.date.accessioned2014-12-08T15:33:16Z-
dc.date.available2014-12-08T15:33:16Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-60768-318-6en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/23149-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3694389en_US
dc.description.abstractIn the study, the growth of InAs on Si is demonstrated using "interface blocking" technique with SiGe layers as buffer layer. And the growth of high quality Ge film on GaAs is demonstrated using ultra high vacuum chemical vapor deposition (UHVCVD). Both Ge film grown on GaAs and InAs film grown on Si substrate demonstrate high crystallinity and good surface morphology as observed by XRD and AFM. Furthermore, the fabrication process and electric characteristics of Ge/GaAs and InAs/Si is discussed in the study. The developed epitaxial materials systems and device fabrication including InAs on Si, Ge on GaAs are useful for future III-V and Ge integration on Si substrate for next generation high speed low power CMOS as well as for RF/digital mixed signal circuit applications in the future.en_US
dc.language.isoen_USen_US
dc.titleThe integration of Ge and III-V materials on GaAs and Si for Post CMOS applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3694389en_US
dc.identifier.journalCHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012)en_US
dc.citation.volume44en_US
dc.citation.issue1en_US
dc.citation.spage715en_US
dc.citation.epage720en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000325403600101-
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