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dc.contributor.authorTrinh, H. D.en_US
dc.contributor.authorBrammertz, G.en_US
dc.contributor.authorChang, E. Y.en_US
dc.contributor.authorKuo, C. I.en_US
dc.contributor.authorLu, C. Y.en_US
dc.contributor.authorLin, Y. C.en_US
dc.contributor.authorNguyen, H. Q.en_US
dc.contributor.authorWong, Y. Y.en_US
dc.contributor.authorTran, B. T.en_US
dc.contributor.authorKakushima, K.en_US
dc.contributor.authorIwai, H.en_US
dc.date.accessioned2014-12-08T15:33:42Z-
dc.date.available2014-12-08T15:33:42Z-
dc.date.issued2011-06-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2011.2128853en_US
dc.identifier.urihttp://hdl.handle.net/11536/23300-
dc.description.abstractEx situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al(2)O(3) on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al(2)O(3)/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.en_US
dc.language.isoen_USen_US
dc.titleElectrical Characterization of Al(2)O(3)/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatmentsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2011.2128853en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume32en_US
dc.citation.issue6en_US
dc.citation.spage752en_US
dc.citation.epage754en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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