完整後設資料紀錄
DC 欄位語言
dc.contributor.authorKuo, Chung-Feng Jeffreyen_US
dc.contributor.authorChen, Jiong-Boen_US
dc.contributor.authorShih, Chung-Yangen_US
dc.contributor.authorHuang, Chao-Yangen_US
dc.date.accessioned2014-12-08T15:35:48Z-
dc.date.available2014-12-08T15:35:48Z-
dc.date.issued2014-06-05en_US
dc.identifier.issn0021-8995en_US
dc.identifier.urihttp://dx.doi.org/10.1002/app.40317en_US
dc.identifier.urihttp://hdl.handle.net/11536/24183-
dc.description.abstractSilicone pressure-sensitive adhesives compositions contain a polydimethylsiloxane and a silicone resin, which can enhance the instant bonding ability and bonding strength of the adhesive. In this study, silicone resin was designed to have a low molecular weight and a highly nonpolar chemical structure. The silicone resin was applied to silicone pressure-sensitive adhesives. The molecular structure of silicone resin was characterized by FT-IR, GPC, H-1-NMR, and Si-29-NMR spectroscopic techniques. Properties such as thermal stability, solubility, hydrophobic, and transparent properties were researched and compared. When the chlorotrimethylsilane increased, it appeared that the amount of silanol groups, molecular weight and thermal stability decreased, while the hydrophobic and transparent properties increased. The silicone resin was completely soluble in toluene and xylene. It was also applied to silicone pressure-sensitive adhesives, resulting in good peel adhesion. (c) 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40317.en_US
dc.language.isoen_USen_US
dc.subjectcompositesen_US
dc.subjectcopolymersen_US
dc.subjectfunctionalization of polymersen_US
dc.subjectadhesivesen_US
dc.titleSilicone Resin Synthesized by Tetraethoxysilane and Chlorotrimethylsilane Through Hydrolysis- Condensation Reactionen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/app.40317en_US
dc.identifier.journalJOURNAL OF APPLIED POLYMER SCIENCEen_US
dc.citation.volume131en_US
dc.citation.issue11en_US
dc.citation.epageen_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000332387300068-
dc.citation.woscount0-
顯示於類別:期刊論文


文件中的檔案:

  1. 000332387300068.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。