標題: Structural design and analysis of micromachined ring-type vibrating sensor of both yaw rate and linear acceleration
作者: Weng, JH
Chieng, WH
Lai, JM
機械工程學系
Department of Mechanical Engineering
關鍵字: gyroscope;accelerometer;symmetry;MEMS
公開日期: 14-Jan-2005
摘要: This work presents the design and analysis of a micromachined ring-type motion sensor which can sense both the yaw rate and linear acceleration of a device in that it is installed. It integrates the functions of a gyroscope and an accelerometer. The design of the microstructure is based on the structure of a vibrating ring gyroscope. The analysis, considering the symmetry of the structure, implies that the rotational symmetry and mirror symmetry of the microstructure markedly affect the performance of the sensor. The modes of vibration determined using finite element analysis and the theoretical calculation of the resonant frequency of the structure are presented. The sensitivities of the characteristic of the sensor to the design specification, the fabrication errors and the theoretical errors are discussed. The structure is fabricated based on deep silicon etching and wafer bonding techniques. The process is developed for eliminating the aspect ratio dependent effect (ARDE) in dry etching process. (C) 2004 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.sna.2004.06.016
http://hdl.handle.net/11536/24193
ISSN: 0924-4247
DOI: 10.1016/j.sna.2004.06.016
期刊: SENSORS AND ACTUATORS A-PHYSICAL
Volume: 117
Issue: 2
起始頁: 230
結束頁: 240
Appears in Collections:Articles


Files in This Item:

  1. 000225343800008.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.