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dc.contributor.authorYang, Jyun-Baoen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorHuang, Jheng-Jieen_US
dc.contributor.authorChen, Yu-Chunen_US
dc.contributor.authorChen, Yu-Tingen_US
dc.contributor.authorTseng, Hsueh-Chihen_US
dc.contributor.authorChu, Ann-Kuoen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2014-12-08T15:35:51Z-
dc.date.available2014-12-08T15:35:51Z-
dc.date.issued2014-04-14en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4871368en_US
dc.identifier.urihttp://hdl.handle.net/11536/24237-
dc.description.abstractIn this study, indium-gallium-zinc-oxide thin film transistors can be operated either as transistors or resistance random access memory devices. Before the forming process, current-voltage curve transfer characteristics are observed, and resistance switching characteristics are measured after a forming process. These resistance switching characteristics exhibit two behaviors, and are dominated by different mechanisms. The mode 1 resistance switching behavior is due to oxygen vacancies, while mode 2 is dominated by the formation of an oxygen-rich layer. Furthermore, an easy approach is proposed to reduce power consumption when using these resistance random access memory devices with the amorphous indium-gallium-zinc-oxide thin film transistor. (C) 2014 AIP Publishing LLC.en_US
dc.language.isoen_USen_US
dc.titleDual operation characteristics of resistance random access memory in indium-gallium-zinc-oxide thin film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4871368en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume104en_US
dc.citation.issue15en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000335145200068-
dc.citation.woscount1-
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