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dc.contributor.authorCHERN, HNen_US
dc.contributor.authorLEE, CLen_US
dc.contributor.authorLEI, TFen_US
dc.date.accessioned2014-12-08T15:04:00Z-
dc.date.available2014-12-08T15:04:00Z-
dc.date.issued1994-05-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.291593en_US
dc.identifier.urihttp://hdl.handle.net/11536/2509-
dc.description.abstractThe effect of fluorine on the polysilicon oxide (polyoxide) characteristics is investigated. It is found that the polyoxide leakage current and breakdown strength are improved as fluorine is incorporated into the oxide film. Experimental results show that the improvement is believed to be due to the oxide stress relaxation rather than the change of the polyoxide/polysilicon interface texture.en_US
dc.language.isoen_USen_US
dc.titleIMPROVEMENT OF POLYSILICON OXIDE CHARACTERISTICS BY FLUORINE INCORPORATIONen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.291593en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume15en_US
dc.citation.issue5en_US
dc.citation.spage181en_US
dc.citation.epage182en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1994NP23600013-
dc.citation.woscount11-
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