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dc.contributor.authorWang, DYen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2014-12-08T15:37:03Z-
dc.date.available2014-12-08T15:37:03Z-
dc.date.issued2005en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/25440-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1948967en_US
dc.description.abstractLayer-by-layer-crystallized SrBi2Ta2O9 (SBT) films were deposited by metallorganic decomposition on a 14-nm-thick HfO2 buffer layer. Experimental results indicate that the metal-ferroelectric-insulator-semiconductor (MFIS) stack with a layer-by-layer-crystallized SBT film exhibits ferroelectric hysteresis and a memory window of around 0.34 V at an operating voltage of 6.0 V. When postdeposition annealing was performed at 850 S C, the layer-by-layer-crystallized MFIS structure exhibited favorable switching characteristics with negligible degradations of the memory window and capacitance retention time. The retention time of this structure exceeded 10(4) s and the extrapolated time was about 105 s. (c) 2005 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleBasic characteristics of Pt/SrBi2Ta2O9/HfO2/Si structure using layer-by-layer crystallizationen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1948967en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume152en_US
dc.citation.issue8en_US
dc.citation.spageG678en_US
dc.citation.epageG683en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000230494000074-
dc.citation.woscount4-
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