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dc.contributor.authorLin, HCen_US
dc.contributor.authorLee, MHen_US
dc.contributor.authorYeh, KLen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:37:06Z-
dc.date.available2014-12-08T15:37:06Z-
dc.date.issued2005en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/25477-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1996512en_US
dc.description.abstractWe demonstrate that it is possible to extract the defect density distribution within the entire energy gap of a poly-Si layer by using a novel Schottky barrier thin-film transistor test structure. Our methodology, albeit based on the well-known field-effect conductance method, does not require two separate n- and p-channel test devices necessary in the conventional methods. This unique and much simplified single-test-device feature is made possible thanks to the ambipolar characteristics and the suppression of subthreshold leakage current in the new test scheme. Effects of process treatments such as plasma hydrogenation could also be clearly resolved using the new test structure. (c) 2005 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleDetermination of effective density-of-states using a novel Schottky barrier poly-Si thin-film transistoren_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1996512en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume8en_US
dc.citation.issue9en_US
dc.citation.spageG249en_US
dc.citation.epageG250en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231259500038-
dc.citation.woscount1-
顯示於類別:期刊論文