Improving spin-coating process using altered cover design

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DC Field	Value	Language
dc.contributor.author	Cheng, CM	en_US
dc.contributor.author	Chen, RH	en_US
dc.date.accessioned	2014-12-08T15:37:13Z	-
dc.date.available	2014-12-08T15:37:13Z	-
dc.date.issued	2004-12-01	en_US
dc.identifier.issn	0021-4922	en_US
dc.identifier.uri	http://dx.doi.org/10.1143/JJAP.43.8028	en_US
dc.identifier.uri	http://hdl.handle.net/11536/25577	-
dc.description.abstract	A novel work chamber cover design for a spin coater that can reduce the effect of airflow on spin coating is presented. The experimental results reveal that superior uniformity and film area can be obtained by utilizing the modified design instead of the conventional design.	en_US
dc.language.iso	en_US	en_US
dc.subject	thick-film photoresist	en_US
dc.subject	spin coating	en_US
dc.subject	work chamber cover	en_US
dc.title	Improving spin-coating process using altered cover design	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1143/JJAP.43.8028	en_US
dc.identifier.journal	JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS	en_US
dc.citation.volume	43	en_US
dc.citation.issue	12	en_US
dc.citation.spage	8028	en_US
dc.citation.epage	8029	en_US
dc.contributor.department	機械工程學系	zh_TW
dc.contributor.department	Department of Mechanical Engineering	en_US
dc.identifier.wosnumber	WOS:000226035000023	-
dc.citation.woscount	1	-
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