標題: Experimental investigation of fabrication properties of electroformed Ni-based micro mould inserts
作者: Cheng, CM
Chen, RH
機械工程學系
Department of Mechanical Engineering
關鍵字: electroforming;SIGA;micro mould insert;SPM;nanoindentation
公開日期: 1-十一月-2004
摘要: In this work, Ni and Ni-Fe micro mould inserts with high aspect ratios are fabricated by Si-LIGA. Many analyses were performed to elucidate the material properties of Ni-based micro mould inserts. The surface properties were examined using a scanning probe microscope (SPM). Nanoindentation was used to measure the elastic modulus and hardness of Ni-Fe microstructures. When the iron content of Ni-Fe micro mould inserts exceeded 12%, the grain size of the Ni-Fe alloy was under 15 nm. Additionally, the mechanical properties of Ni-based microstructures obtained by electroformng are superior to those obtained by casting or powder metallurgy. Satisfactory electroforming current densities for obtaining a mould insert with a fine surface profile ranged from 4 ASD to 6 ASD. (C) 2004 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.mee.2004.07.066
http://hdl.handle.net/11536/25662
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.07.066
期刊: MICROELECTRONIC ENGINEERING
Volume: 75
Issue: 4
起始頁: 423
結束頁: 432
顯示於類別:期刊論文


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