標題: | Experimental investigation of fabrication properties of electroformed Ni-based micro mould inserts |
作者: | Cheng, CM Chen, RH 機械工程學系 Department of Mechanical Engineering |
關鍵字: | electroforming;SIGA;micro mould insert;SPM;nanoindentation |
公開日期: | 1-十一月-2004 |
摘要: | In this work, Ni and Ni-Fe micro mould inserts with high aspect ratios are fabricated by Si-LIGA. Many analyses were performed to elucidate the material properties of Ni-based micro mould inserts. The surface properties were examined using a scanning probe microscope (SPM). Nanoindentation was used to measure the elastic modulus and hardness of Ni-Fe microstructures. When the iron content of Ni-Fe micro mould inserts exceeded 12%, the grain size of the Ni-Fe alloy was under 15 nm. Additionally, the mechanical properties of Ni-based microstructures obtained by electroformng are superior to those obtained by casting or powder metallurgy. Satisfactory electroforming current densities for obtaining a mould insert with a fine surface profile ranged from 4 ASD to 6 ASD. (C) 2004 Elsevier B.V. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.mee.2004.07.066 http://hdl.handle.net/11536/25662 |
ISSN: | 0167-9317 |
DOI: | 10.1016/j.mee.2004.07.066 |
期刊: | MICROELECTRONIC ENGINEERING |
Volume: | 75 |
Issue: | 4 |
起始頁: | 423 |
結束頁: | 432 |
顯示於類別: | 期刊論文 |