標題: Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insert
作者: Yeh, YM
Tu, GC
Fu, MN
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: UV-LIGA;electroforming;mass transfer effect;Ni-Fe;mold insert
公開日期: 1-十月-2003
摘要: UV (ultra violet)-LIGA (a German acronym for lithographic, gavanoformung, abformung), a low-cost microcomponent manufacturing technology for micro-electromechanical systems (MEMS), combines the UV patterning of thick photoresist layers with the molding of the resulting patterns by electroforming. It enables mass production of microcomponents using microinjection molding or hot embossing technology. This paper addresses the characteristics of the flow field and the mass transfer effect during micro-electroforming processes. A micro-electroforming experiment is conducted and a simulation is performed to determine optimal conditions for fine surface forming by micro-electroforming. Results show that a smaller diameter of a hole corresponds to poorer plating bath transfer. Plating bath can be replenished by increasing the rotation speed of the electrodes. However, mass transfer is still limited in holes with a high aspect ratio. The theoretical results of simulation analysis were verified by conducting practical electroforming experiments.
URI: http://hdl.handle.net/11536/27483
ISSN: 0021-4922
期刊: JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
Volume: 42
Issue: 10
起始頁: 6683
結束頁: 6690
顯示於類別:期刊論文


文件中的檔案:

  1. 000186948400088.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。