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dc.contributor.authorHuang, HWen_US
dc.contributor.authorKao, CCen_US
dc.contributor.authorChu, JTen_US
dc.contributor.authorKuo, HCen_US
dc.contributor.authorWang, SCen_US
dc.contributor.authorYu, CCen_US
dc.contributor.authorLin, CFen_US
dc.date.accessioned2014-12-08T15:37:27Z-
dc.date.available2014-12-08T15:37:27Z-
dc.date.issued2004-10-15en_US
dc.identifier.issn0921-5107en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mseb.2004.05.024en_US
dc.identifier.urihttp://hdl.handle.net/11536/25760-
dc.description.abstractWe report the electrical and optical characteristics of GaN light emitting diode (LED) with beryllium (Be) implanted Mg-doped GaN layer. The p-type layer of Be-implanted GaN LED showed a higher hole carrier concentration of 2.3 x 10(18)CM(-3) and low specific contact resistance value of 2.0 x 10(-4) Omegacm(2) than as-grown p-GaN LED samples without Be-implantation. The Be-implanted GaN LEDs with InGaN/GaN MQW show slightly lower light output (about 10%) than the as-grown GaN LEDs, caused by the high RTA temperature annealing process. (C) 2004 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectGallium nitride (GaN)en_US
dc.subjectlight emitting diode (LED)en_US
dc.titleInvestigation of GaN LED with Be-implanted Mg-doped GaN layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.mseb.2004.05.024en_US
dc.identifier.journalMATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGYen_US
dc.citation.volume113en_US
dc.citation.issue1en_US
dc.citation.spage19en_US
dc.citation.epage23en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000224050000004-
dc.citation.woscount4-
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