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dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorChou, Yi-Tehen_US
dc.contributor.authorTeng, Li-Fengen_US
dc.contributor.authorLi, Fu-Haien_US
dc.contributor.authorShieh, Han-Pingen_US
dc.date.accessioned2014-12-08T15:37:36Z-
dc.date.available2014-12-08T15:37:36Z-
dc.date.issued2011-01-31en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.3551537en_US
dc.identifier.urihttp://hdl.handle.net/11536/25860-
dc.description.abstractThis work presents the electrical characteristics of the nitrogenated amorphous InGaZnO thin film transistor (a-IGZO:N TFT). The a-IGZO: N film acting as a channel layer of a thin film transistor (TFT) device was prepared by dc reactive sputter with a nitrogen and argon gas mixture at room temperature. Experimental results show that the in situ nitrogen incorporation to IGZO film can properly adjust the threshold voltage and enhance the ambient stability of a TFT device. Furthermore, the a-IGZO: N TFT has a 44% increase in the carrier mobility and electrical reliability and uniformity also progress obviously while comparing with those not implementing a nitrogen doping process. (C) 2011 American Institute of Physics. [doi:10.1063/1.3551537]en_US
dc.language.isoen_USen_US
dc.titleNitrogenated amorphous InGaZnO thin film transistoren_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.3551537en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume98en_US
dc.citation.issue5en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000286988400030-
dc.citation.woscount20-
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