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dc.contributor.authorHuang, C. C.en_US
dc.contributor.authorChang, S. J.en_US
dc.contributor.authorKuo, C. H.en_US
dc.contributor.authorWu, C. H.en_US
dc.contributor.authorKo, C. H.en_US
dc.contributor.authorWann, Clement H.en_US
dc.contributor.authorCheng, Y. C.en_US
dc.contributor.authorLin, W. J.en_US
dc.date.accessioned2014-12-08T15:37:49Z-
dc.date.available2014-12-08T15:37:49Z-
dc.date.issued2011en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/26002-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3569753en_US
dc.description.abstractThe authors report the growth of GaN epitaxial layers on nano-patterned Si(001) substrates prepared by the standard facilities used in integrated circuit (IC) industry. It was found that we could achieve high-quality single crystalline GaN by using the 50 nm SiO(2) recess patterned Si(001) substrate. It was also found that we can reduce the tensile stress in GaN epitaxial layer by about 95% using the nano-patterned Si(001) substrate, as compared to the conventional un-patterned Si(111) substrate. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3569753] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleSingle Crystalline GaN Epitaxial Layer Prepared on Nano-Patterned Si(001) Substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3569753en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume158en_US
dc.citation.issue6en_US
dc.citation.spageH626en_US
dc.citation.epageH629en_US
dc.contributor.department照明與能源光電研究所zh_TW
dc.contributor.departmentInstitute of Lighting and Energy Photonicsen_US
dc.identifier.wosnumberWOS:000289854700087-
dc.citation.woscount0-
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