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dc.contributor.authorFan, Shih-Kangen_US
dc.contributor.authorYang, Hanpingen_US
dc.contributor.authorHsu, Wensyangen_US
dc.date.accessioned2014-12-08T15:38:06Z-
dc.date.available2014-12-08T15:38:06Z-
dc.date.issued2011en_US
dc.identifier.issn1473-0197en_US
dc.identifier.urihttp://hdl.handle.net/11536/26134-
dc.identifier.urihttp://dx.doi.org/10.1039/c0lc00178cen_US
dc.description.abstractWe present a long (204 mm), curved (curvature of 0.04 mm(-1)), and closed droplet pathway in "droplet-on-a-wristband" (DOW) with the designed digital microfluidic modular interfaces for electric signal and droplet connections based on the study of electrowetting-on-dielectric (EWOD) in inclined and curved devices. Instead of using sealed and leakage-proof pipes to transmit liquid and pumping pressure, the demonstrated modular interface for electrowetting-driven digital microfluidics provides simply electric and fluidic connections between two adjacent parallel-plate modules which are easy-to-attach/detach, showing the advantages of using droplets for microfluidic connections between modules. With the previously reported digital-to-channel interfaces (Abdelgawad et al., Lab Chip, 2009, 9, 1046-1051), the chip-to-chip interface presented here would be further applied to continuous microfluidics. Droplet pumping across a single top plate gap and through a modular interface with two gaps between overlapping plates are investigated. To ensure the droplet transportation in the DOW, we actuate droplets against gravity in an inclined or curved device fabricated on flexible PET substrates prepared by a special razor blade cutter and low temperature processes. Pumping a 2.5 mu l droplet at a speed above 105 mm s(-1) is achieved by sequentially switching the entire 136 driving electrodes (1.5 mm x 1.5 mm) along the four flexible modules of the DOW fabricated by 4-inch wafer facilities.en_US
dc.language.isoen_USen_US
dc.titleDroplet-on-a-wristband: Chip-to-chip digital microfluidic interfaces between replaceable and flexible electrowetting modulesen_US
dc.typeArticleen_US
dc.identifier.doi10.1039/c0lc00178cen_US
dc.identifier.journalLAB ON A CHIPen_US
dc.citation.volume11en_US
dc.citation.issue2en_US
dc.citation.spage343en_US
dc.citation.epage347en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000285514700022-
dc.citation.woscount12-
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