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dc.contributor.authorLin, Chia-Shengen_US
dc.contributor.authorChen, Ying-Chungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLi, Hung-Weien_US
dc.contributor.authorChen, Shih-Chingen_US
dc.contributor.authorHsu, Wei-Cheen_US
dc.contributor.authorJian, Fu-Yenen_US
dc.contributor.authorChen, Te-Chihen_US
dc.contributor.authorTai, Ya-Hsiangen_US
dc.date.accessioned2014-12-08T15:38:10Z-
dc.date.available2014-12-08T15:38:10Z-
dc.date.issued2011en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/26186-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3507253en_US
dc.description.abstractThis work investigates dynamic negative bias temperature instability (NBTI) in p-channel low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs) with different rise and fall times. Experimental results reveal identical increases in the interface state density (N(it)) induced by different dynamic NBTI stress conditions. Nevertheless, the degradation of the grain boundary trap (N(trap)) becomes more significant as rise time decreases to 1 mu s. Because the surface inversion layer cannot form during the short rise time, transient bulk voltage will cause excess holes to diffuse into the poly-Si bulk. Therefore, the significant N(trap) increase is assisted by this transient effect. (c) 2010 The Electrochemical Society. [DOI: 10.1149/1.3507253] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleTransient Effect Assisted NBTI Degradation in p-Channel LTPS TFTs under Dynamic Stressen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3507253en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume158en_US
dc.citation.issue1en_US
dc.citation.spageH10en_US
dc.citation.epageH14en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000284697900037-
dc.citation.woscount1-
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