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dc.contributor.authorWang, Sheng-Yuen_US
dc.contributor.authorLee, Dai-Yingen_US
dc.contributor.authorHuang, Tai-Yuenen_US
dc.contributor.authorWu, Jia-Woeien_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2014-12-08T15:38:18Z-
dc.date.available2014-12-08T15:38:18Z-
dc.date.issued2010-12-10en_US
dc.identifier.issn0957-4484en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0957-4484/21/49/495201en_US
dc.identifier.urihttp://hdl.handle.net/11536/26235-
dc.description.abstractIn this study, the resistive switching characteristics of a ZrO(2)-based memory film with an embedded Mo layer are investigated. The experimental results show that the forming process can be removed by inserting an embedded Mo metal layer within ZrO(2) via a post-annealing process. The excellent memory performance, which includes lower operation voltage (<1.5 V), good endurance (>10(3) cycles), a stubborn nondestructive readout property (>10(4) s), and long retention time (>10(7) s), is also demonstrated. Moreover, high-speed operation (10 ns) can be successively maintained over 10(3) cycles without any operational errors observed in this memory device. Due to the interface layer induced by the Ti top electrode, the formation and rupture of conducting filaments are suggested to occur near the Ti/ZrO(2) interface. The oxygen vacancies induced by the embedded Mo can enhance the formation of conducting filaments and further improve the switching characteristics in ZrO(2)-based devices.en_US
dc.language.isoen_USen_US
dc.titleControllable oxygen vacancies to enhance resistive switching performance in a ZrO(2)-based RRAM with embedded Mo layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0957-4484/21/49/495201en_US
dc.identifier.journalNANOTECHNOLOGYen_US
dc.citation.volume21en_US
dc.citation.issue49en_US
dc.citation.spageen_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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