Full metadata record
DC FieldValueLanguage
dc.contributor.authorKao, YLen_US
dc.contributor.authorTu, GCen_US
dc.contributor.authorHuang, CAen_US
dc.contributor.authorChang, JHen_US
dc.date.accessioned2014-12-08T15:38:31Z-
dc.date.available2014-12-08T15:38:31Z-
dc.date.issued2004-09-25en_US
dc.identifier.issn0921-5093en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.msea.2004.04.028en_US
dc.identifier.urihttp://hdl.handle.net/11536/26368-
dc.description.abstractThe annealing behavior of electroplated copper deposits is reported in this study. The copper deposits were electroplated with a current density of 0.7 A/cm(2) at 53 degreesC in a sulfuric acid bath containing various concentrations of thiourea. The hardness values of the copper deposits were measured before and after annealing, and the differential scanning calorimetry (DSC) diagrams of the as-electroplated copper deposits were recorded. An improvement of the softening resistance of the copper deposits was observed when the bath contained thiourea greater than or equal to3 mg/L. By adding thiourea in the plating bath, smaller grain size of the copper deposits can be achieved. As thiourea content increased greater than or equal to3 mg/L, the twin boundary of the copper deposits was significantly increased, and many sulfur-rich particles were deposited along the grain boundaries and a few within the grains of the deposit. These sulfur-rich particles are capable of impeding migration of the grain boundaries and improving the softening resistance of the copper deposits during annealing. The aforementioned microstructures of the copper deposits were examined with transmission electron microscope (TEM) integrated with energy-dispersive X-ray spectrometer (EDX) for chemical composition analysis. (C) 2004 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectannealingen_US
dc.subjectcopper depositen_US
dc.subjectthioureaen_US
dc.subjectsoftening resistanceen_US
dc.subjectsulfur-rich particle depositen_US
dc.titleThe annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thioureaen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.msea.2004.04.028en_US
dc.identifier.journalMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSINGen_US
dc.citation.volume382en_US
dc.citation.issue1-2en_US
dc.citation.spage104en_US
dc.citation.epage111en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000224264900014-
dc.citation.woscount15-
Appears in Collections:Articles


Files in This Item:

  1. 000224264900014.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.