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dc.contributor.authorLin, CSen_US
dc.contributor.authorChi, CYen_US
dc.date.accessioned2014-12-08T15:38:38Z-
dc.date.available2014-12-08T15:38:38Z-
dc.date.issued2004-09-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2004.05.014en_US
dc.identifier.urihttp://hdl.handle.net/11536/26438-
dc.description.abstractThe development of chemical-mechanical planarization (CMP) to date relies on multi-stage polishing for better performance. The straight relationship between performance and operation provides a new method of control for CMP process. The strategy of dynamic tuning is proposed in this paper and one possible operation profile is established via sliding-mode theory. Because of the lack of operation mechanism of the equipment in existence, more elaborate experimental verification of the strategy is yet to follow. We may need to work with some equipment suppliers. Based on the proposed strategy, lower dishing and more efficient copper step height reduction can be verified from some numerical simulations. Simulation results show better performance under the same throughput. (C) 2004 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdynamic tuningen_US
dc.subjectchemical mechanical planarizationen_US
dc.subjectdishingen_US
dc.titleDynamic tuning of chemical-mechanical planarization operation via sliding-mode theoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.mee.2004.05.014en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume75en_US
dc.citation.issue3en_US
dc.citation.spage285en_US
dc.citation.epage296en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000224012200007-
dc.citation.woscount1-
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