完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, CS | en_US |
dc.contributor.author | Chi, CY | en_US |
dc.date.accessioned | 2014-12-08T15:38:38Z | - |
dc.date.available | 2014-12-08T15:38:38Z | - |
dc.date.issued | 2004-09-01 | en_US |
dc.identifier.issn | 0167-9317 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.mee.2004.05.014 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/26438 | - |
dc.description.abstract | The development of chemical-mechanical planarization (CMP) to date relies on multi-stage polishing for better performance. The straight relationship between performance and operation provides a new method of control for CMP process. The strategy of dynamic tuning is proposed in this paper and one possible operation profile is established via sliding-mode theory. Because of the lack of operation mechanism of the equipment in existence, more elaborate experimental verification of the strategy is yet to follow. We may need to work with some equipment suppliers. Based on the proposed strategy, lower dishing and more efficient copper step height reduction can be verified from some numerical simulations. Simulation results show better performance under the same throughput. (C) 2004 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | dynamic tuning | en_US |
dc.subject | chemical mechanical planarization | en_US |
dc.subject | dishing | en_US |
dc.title | Dynamic tuning of chemical-mechanical planarization operation via sliding-mode theory | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.mee.2004.05.014 | en_US |
dc.identifier.journal | MICROELECTRONIC ENGINEERING | en_US |
dc.citation.volume | 75 | en_US |
dc.citation.issue | 3 | en_US |
dc.citation.spage | 285 | en_US |
dc.citation.epage | 296 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000224012200007 | - |
dc.citation.woscount | 1 | - |
顯示於類別: | 期刊論文 |