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dc.contributor.authorWu, JWen_US
dc.contributor.authorCheng, CCen_US
dc.contributor.authorChiu, KLen_US
dc.contributor.authorGuo, JCen_US
dc.contributor.authorLien, WYen_US
dc.contributor.authorChang, CSen_US
dc.contributor.authorHuang, GWen_US
dc.contributor.authorWang, THen_US
dc.date.accessioned2014-12-08T15:38:44Z-
dc.date.available2014-12-08T15:38:44Z-
dc.date.issued2004-08-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2004.831369en_US
dc.identifier.urihttp://hdl.handle.net/11536/26503-
dc.description.abstractThe pocket implantation effect on drain current flicker noise in 0.13 mum CMOS process based high performance analog nMOSFETs is investigated. Our result shows that pocket implantation will significantly degrade device low-frequency noise primarily because of nonuniform threshold voltage distribution along the channel. An analytical flicker noise model to account for a pocket doping effect is proposed. In our model, the local threshold voltage and the width of the pocket implant region are extracted from the measured reverse short-channel effect, and the oxide trap density is extracted from a long-channel device. Good agreement between our model and the measurement result is obtained without other fitting parameters.en_US
dc.language.isoen_USen_US
dc.subjectflicker noiseen_US
dc.subjectmodelingen_US
dc.subjectnonuniform threshold voltageen_US
dc.subjectpocket implanten_US
dc.titlePocket implantation effect on drain current flicker noise in analog nMOSFET devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2004.831369en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume51en_US
dc.citation.issue8en_US
dc.citation.spage1262en_US
dc.citation.epage1266en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000222904000007-
dc.citation.woscount15-
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