A novel four-mask-processed poly-Si TFT fabricated using excimer laser crystallization of an edge-thickened alpha-Si active island

Abstract

A novel four-mask-processed polycrystalline silicon thin-film transistor (poly-Si TFT) is fabricated using 50-pulse KrF excimer laser to crystallize an edge-thickened amorphous silicon (a-Si) active island without any shrinkage. This method introduces a temperature gradient in the island to enlarge grains from the edge, especially when the channel width is narrow. The grain boundaries across the width of the channel suppress the leakage current and the drain-induced barrier lowering. Moreover, the proposed poly-Si TFT with a channel length of L = 2 mum and a channel width of W = 1.2 mum possesses a high field-effect mobility of 260 cm(2)/Vs and an on/off current ratio of 2.31 x 10(8).