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dc.contributor.authorCheng, Hui-Wenen_US
dc.contributor.authorLi, Fu-Haien_US
dc.contributor.authorHan, Ming-Hungen_US
dc.contributor.authorYiu, Chun-Yenen_US
dc.contributor.authorYu, Chia-Huien_US
dc.contributor.authorLee, Kuo-Fuen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2014-12-08T15:39:18Z-
dc.date.available2014-12-08T15:39:18Z-
dc.date.issued2010en_US
dc.identifier.isbn978-1-4244-7419-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/26843-
dc.description.abstractThis work, for the first time, examines the work function fluctuation (WKF) and interface trap fluctuation (ITF) using experimentally calibrated 3D device simulation on high-kappa / metal gate technology. The random WKs result in 36.7 mV threshold voltage fluctuation (sigma V(th)) for 16 nm N-MOSFETs with TiN gate, which is rather different from the result of averaged WKF (AWKF) method [1] due to localized random WK effect. The ITF affects the subthreshold region (the normalized sigma I(D) > 48%) and is suppressed for devices under strong inversion. Estimation of statistical covariance confirms the dependence of IT on the metal gate's WK; thus, the impacts of WKF and ITF on device and circuit variability should be considered together properly. Such variability induced static noise margin fluctuation of SRAM exceeds the influence of random dopants and cannot be ignored.en_US
dc.language.isoen_USen_US
dc.title3D Device Simulation of Work Function and Interface Trap Fluctuations on High-kappa/Metal Gate Devicesen_US
dc.typeArticleen_US
dc.identifier.journal2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGESTen_US
dc.contributor.department傳播研究所zh_TW
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.identifier.wosnumberWOS:000287997300094-
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