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dc.contributor.authorKao, CKen_US
dc.contributor.authorYan, JKen_US
dc.contributor.authorChang, Len_US
dc.contributor.authorCho, SYen_US
dc.contributor.authorChen, HGen_US
dc.date.accessioned2014-12-08T15:39:25Z-
dc.date.available2014-12-08T15:39:25Z-
dc.date.issued2004-04-01en_US
dc.identifier.issn0925-9635en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.diamond.2004.01.029en_US
dc.identifier.urihttp://hdl.handle.net/11536/26913-
dc.description.abstractAu/amorphous Si/SiO2/Si structure was used as substrate for diamond deposition by microwave plasma CVD. The Au-Si phase diagram shows a eutectic point at 363 degreesC. At deposition temperatures of 700-800 degreesC, the Au and amorphous Si films were alloyed as liquid during deposition, which resulted in formation of an array of single crystalline Si whiskers. Microstructural characterization shows that the Si whiskers have a diameter in the range of 50 nm-5 mum with facet on the top surface. The Si whiskers are shown to be oriented along <311> directions. Diamond particles deposited are found only on top of the Si whiskers. The diamond particles can be either of polycrystalline or single crystalline characteristics. (C) 2004 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdiamond crystalen_US
dc.subjectchemical vapor depositionen_US
dc.subjectmorphologyen_US
dc.titleDiamond deposition on Au/amorphotis Si thin filmsen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.diamond.2004.01.029en_US
dc.identifier.journalDIAMOND AND RELATED MATERIALSen_US
dc.citation.volume13en_US
dc.citation.issue4-8en_US
dc.citation.spage585en_US
dc.citation.epage589en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000221691100009-
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