Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lan, JK | en_US |
dc.contributor.author | Wang, YL | en_US |
dc.contributor.author | Liu, CP | en_US |
dc.contributor.author | Lee, WH | en_US |
dc.contributor.author | Ay, C | en_US |
dc.contributor.author | Cheng, YL | en_US |
dc.contributor.author | Chang, SC | en_US |
dc.date.accessioned | 2014-12-08T15:39:43Z | - |
dc.date.available | 2014-12-08T15:39:43Z | - |
dc.date.issued | 2004-01-30 | en_US |
dc.identifier.issn | 0040-6090 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.tsf.2003.09.039 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/27124 | - |
dc.description.abstract | This paper investigates. the monitor and elimination methods for the circular defects in high-density-plasma shallow trench isolation (HDP-STI) deposition process. The optical measurement method can monitor the circular defects in early stage. When the thickness of silane-burst film exceeds 7.8 nm, the fit-error can alert the circular defects. The oxynitride/oxide composite liner can eliminate the circular defects. Besides this, the oxynitride/oxide composite liner can also improve the breakdown strength of the STI oxide. The breakdown strength of the STI oxide increases, respectively, 375 and 30% in the wafer center and edge. The uniformity of the STI breakdown strength was reduced from greater than 200% to less than 10% using the composite liner. The traditional N2O plasma treatment for stabilizing the oxynitride film is harmful in the HDP-STI process. The N2O plasma treatment shows the worst circular defect performance. (C) 2003 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | shallow trench isolation | en_US |
dc.subject | composite liner | en_US |
dc.subject | circular defects | en_US |
dc.title | Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner | en_US |
dc.type | Article; Proceedings Paper | en_US |
dc.identifier.doi | 10.1016/j.tsf.2003.09.039 | en_US |
dc.identifier.journal | THIN SOLID FILMS | en_US |
dc.citation.volume | 447 | en_US |
dc.citation.issue | en_US | |
dc.citation.spage | 645 | en_US |
dc.citation.epage | 650 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000188995700111 | - |
Appears in Collections: | Conferences Paper |
Files in This Item:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.