完整後設資料紀錄
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dc.contributor.authorWang, JCen_US
dc.contributor.authorShie, DCen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:40:13Z-
dc.date.available2014-12-08T15:40:13Z-
dc.date.issued2003-10-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1605272en_US
dc.identifier.urihttp://hdl.handle.net/11536/27469-
dc.description.abstractFor the first time, the characteristics and temperature dependence of electrical properties for ultrathin HfO2 gate dielectrics treated in NH3 plasma after deposition were investigated. After this treatment, significant nitrogen incorporation at the HfO2/silicon interface (interfacial layer) was examined by Auger electron spectroscopy. Moreover, the formation of Hf-N bonding and the suppression of Hf-Si bonding were observed from electron spectroscopy for chemical analysis spectra. The activation energy of charge trapping reflected in the current-voltage characteristics was effectively reduced, which led to improved hysteresis and its weaker temperature dependence in HfO2 gate dielectrics treated in NH3 plasma. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleCharacterization of temperature dependence for HfO2 gate dielectrics treated in NH3 plasmaen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1605272en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume6en_US
dc.citation.issue10en_US
dc.citation.spageF34en_US
dc.citation.epageF36en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000185007900015-
dc.citation.woscount19-
顯示於類別:期刊論文