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dc.contributor.authorChang, FLen_US
dc.contributor.authorLin, MJen_US
dc.contributor.authorLee, GYen_US
dc.contributor.authorChen, YSen_US
dc.contributor.authorLiaw, CWen_US
dc.contributor.authorCheng, HCen_US
dc.date.accessioned2014-12-08T15:40:14Z-
dc.date.available2014-12-08T15:40:14Z-
dc.date.issued2003-10-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0038-1101(03)00143-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/27477-
dc.description.abstractIn this paper, a partition method is proposed to Study the high voltage devices with the step doping profile for the first time. It has been proposed that its breakdown voltage can be approached to that of the linearly graded devices with similar forward voltage drop (V-cc). In addition, by this method, the breakdown voltage can be deduced and its corresponding issue location is also fingered out in the step drift region. Furthermore. in order to reduce the undesirable additional masks, the degraded factor (D) is developed to obtain better performance with the least number of frames. Eventually, a 660 V step analytical results are compared with a 606.6 V MEDICI Simulation and this shows that the partition method is very effective. (C) 2003 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectstep drift doping profileen_US
dc.subjectlinearly graded dopingen_US
dc.subjectSOI-LIGBTen_US
dc.titleModeling and design of the high performance step SOI-LIGBT power devices by partition mid-point methoden_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0038-1101(03)00143-6en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume47en_US
dc.citation.issue10en_US
dc.citation.spage1693en_US
dc.citation.epage1698en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000185129400016-
dc.citation.woscount6-
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