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dc.contributor.authorCHERN, HNen_US
dc.contributor.authorLEE, CLen_US
dc.contributor.authorLEI, TFen_US
dc.date.accessioned2014-12-08T15:04:15Z-
dc.date.available2014-12-08T15:04:15Z-
dc.date.issued1993-12-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.249479en_US
dc.identifier.urihttp://hdl.handle.net/11536/2751-
dc.description.abstractThe effects of H-2-plasma followed by O-2-plasma treatment on n-channel polysilicon TFT's were investigated. It was found that the H-2-O-2-plasma treatment is more effective in passivating the trap states of polysilicon films than do the H-2-plasma treatment only or the O-2-plasma treatment only. Hence, it is more effective in improving the device performance on the subthreshold swing, carrier mobility and the current ON/OFF ratio. It is also found that thermal annealing on plasma-treated devices increases the deep states but has no effect on the tail states of the devices.en_US
dc.language.isoen_USen_US
dc.titleTHE EFFECTS OF H-2-O-2-PLASMA TREATMENT ON THE CHARACTERISTICS OF POLYSILICON THIN-FILM TRANSISTORSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.249479en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume40en_US
dc.citation.issue12en_US
dc.citation.spage2301en_US
dc.citation.epage2306en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department奈米中心zh_TW
dc.contributor.department次微米人才培訓中心zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentNano Facility Centeren_US
dc.contributor.departmentCTR SUBMICRON PROFESS TRAININGen_US
dc.identifier.wosnumberWOS:A1993MP36300021-
dc.citation.woscount22-
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