標題: | FABRICATION AND PROPERTIES OF ALUMINO-BORO-SILICATE GLASS-CERAMIC SYSTEMS |
作者: | CHIOU, BS TZENG, JM DUH, JG 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 1-十二月-1993 |
摘要: | In current microelectronics packaging applications, low-temperature fired substrates with low dielectric constant are required. Formulations of SiO2, B2O3, Al2O3, and CaO have been used as substrate materials which can be sintered as low as 1000-degrees-C in air. The electrical behaviour, thermal expansion coefficient, and mechanical property of the fabricated substrate materials are evaluated. The as-sintered substrates possess the following characteristics: low dielectric constant of 4-5 at 1 MHz; a loss factor smaller than 0.2% at 1 MHz; and a thermal expansion of 3.57 x 10(-6)-degrees-C-1 which is very close to that of silicon (3.5 x 10(-6)-degrees-C-1). |
URI: | http://dx.doi.org/10.1007/BF00179228 http://hdl.handle.net/11536/2755 |
ISSN: | 0957-4522 |
DOI: | 10.1007/BF00179228 |
期刊: | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS |
Volume: | 4 |
Issue: | 4 |
起始頁: | 301 |
結束頁: | 304 |
顯示於類別: | 期刊論文 |