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dc.contributor.authorSun, CLen_US
dc.contributor.authorChen, SYen_US
dc.date.accessioned2014-12-08T15:40:24Z-
dc.date.available2014-12-08T15:40:24Z-
dc.date.issued2003-09-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1597885en_US
dc.identifier.urihttp://hdl.handle.net/11536/27579-
dc.description.abstractA novel face-to-face annealing process was used to investigate the enhanced electrical characteristics in Bi3.25La0.75Ti3O12 (BLT)/Al2O3/Si capacitors annealed at high temperatures. The low leakage current of BLT/Al2O3/Si capacitors can be obtained after high temperature annealing and the mechanism has been clarified and attributed to the formation of Si-rich aluminum oxide. The surface composition of aluminum oxide after annealing was further analyzed by X-ray photoelectron spectrometer (XPS) and XPS spectra revealed that the aluminum oxide would react with both Si substrate and BLT thin films to form Si-rich aluminum oxide. Because the aluminum oxide has weaker bonding than that of silicon oxide, Si composition can quench the electrical defects in aluminum oxide so as to reduce the leakage current of BLT/Al2O3/Si capacitors. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleRole of interface reaction at high temperature in electrical characteristics of Bi3.25La0.75Ti3O12/Al2O3/Si capacitorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1597885en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume150en_US
dc.citation.issue9en_US
dc.citation.spageC600en_US
dc.citation.epageC602en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000184673100031-
dc.citation.woscount1-
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