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dc.contributor.authorChang, TCen_US
dc.contributor.authorTsai, TMen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorMor, YSen_US
dc.contributor.authorChen, CWen_US
dc.contributor.authorSheu, JTen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:40:42Z-
dc.date.available2014-12-08T15:40:42Z-
dc.date.issued2003-07-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1576571en_US
dc.identifier.urihttp://hdl.handle.net/11536/27766-
dc.language.isoen_USen_US
dc.titleDirect Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology (vol 6, pg G69, 2003)en_US
dc.typeCorrectionen_US
dc.identifier.doi10.1149/1.1576571en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume6en_US
dc.citation.issue7en_US
dc.citation.spageL3en_US
dc.citation.epageL3en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000183151000017-
dc.citation.woscount0-
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