| 標題: | Highly reliable nickel silicide formation with a Zr capping layer |
| 作者: | Lee, TL Lee, JW Lee, MC Lei, TF Lee, CL 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
| 公開日期: | 1-五月-2003 |
| 摘要: | Zr is proposed to be the capping layer for nickel silicide to obtain a stable low resistance contact system even at an annealing temperature as high as 850degreesC. A NiSi monolayer is the only phase observed in those samples annealed from 500 to 850degreesC. Experimental results from transmission electron microscopy and X-ray diffractometry analysis show that the agglomeration and precipitate of nickel silicide problems which are usually encountered in the NiSi system are eliminated. (C) 2003 The Electrochemical Society. |
| URI: | http://dx.doi.org/10.1149/1.1563093 http://hdl.handle.net/11536/27935 |
| ISSN: | 1099-0062 |
| DOI: | 10.1149/1.1563093 |
| 期刊: | ELECTROCHEMICAL AND SOLID STATE LETTERS |
| Volume: | 6 |
| Issue: | 5 |
| 起始頁: | G66 |
| 結束頁: | G68 |
| 顯示於類別: | 期刊論文 |

