標題: Highly reliable nickel silicide formation with a Zr capping layer
作者: Lee, TL
Lee, JW
Lee, MC
Lei, TF
Lee, CL
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-五月-2003
摘要: Zr is proposed to be the capping layer for nickel silicide to obtain a stable low resistance contact system even at an annealing temperature as high as 850degreesC. A NiSi monolayer is the only phase observed in those samples annealed from 500 to 850degreesC. Experimental results from transmission electron microscopy and X-ray diffractometry analysis show that the agglomeration and precipitate of nickel silicide problems which are usually encountered in the NiSi system are eliminated. (C) 2003 The Electrochemical Society.
URI: http://dx.doi.org/10.1149/1.1563093
http://hdl.handle.net/11536/27935
ISSN: 1099-0062
DOI: 10.1149/1.1563093
期刊: ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume: 6
Issue: 5
起始頁: G66
結束頁: G68
顯示於類別:期刊論文