Title: Moisture-induced material instability of porous organosilicate glass
Authors: Chang, TC
Chen, CW
Liu, PT
Mor, YS
Tsai, HM
Tsai, TM
Yan, ST
Tu, CH
Tseng, TY
Sze, SM
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Issue Date: 1-Apr-2003
Abstract: The mechanism of leakage current of porous organosilicate glass (POSG) with O-2 plasma ashing is investigated. The O-2 plasma ashing often deteriorates the POSG film, causing moisture uptake. We find that the leakage-current mechanism of POSG transforms from Schottky emission into ionic conduction after O-2 plasma treatment. The mobile ions (H+,OH-) supported by absorbing moisture move easily when an external electric field is applied to POSG film, which leads to the ionic conduction leakage current across the moisture-absorbing POSG film. Hence, the leakage current density is drastically increased about four to five orders of magnitude compared with untreated POSG film. (C) 2003 The Electrochemical Society.
URI: http://dx.doi.org/10.1149/1.1557032
http://hdl.handle.net/11536/27974
ISSN: 1099-0062
DOI: 10.1149/1.1557032
Journal: ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume: 6
Issue: 4
Begin Page: F13
End Page: F15
Appears in Collections:Articles