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dc.contributor.authorSun, CLen_US
dc.contributor.authorHsu, JJen_US
dc.contributor.authorChen, SYen_US
dc.contributor.authorChin, Aen_US
dc.date.accessioned2014-12-08T15:41:16Z-
dc.date.available2014-12-08T15:41:16Z-
dc.date.issued2003-03-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1542901en_US
dc.identifier.urihttp://hdl.handle.net/11536/28062-
dc.description.abstractPb(ZrxTi1-)O-3 (PZT) thin films have been prepared on Al2O3/Si and PbTiO3/Al2O3/Si substrates, respectively. On Al2O3/Si substrates, Ti-rich PZT thin films had lower perovskite transformation temperatures than those of Zr-rich PZT films. Therefore, PbTiO3 was used as the seeding layer on Al2O3/Si to form a PbTiO3/Al2O3/Si substrate. The threshold voltage shift of a PZT(53/ 47)/PbTiO3/Al2O3/Si capacitor reaches 9 V with +/-10 V writing voltages, which is much larger than the 2 V of the PZT(0/100)/PbTiO3/Al2O3/Si capacitor. Different memory mechanisms in the capacitance-voltage characteristics of capacitors were further examined and discussed in this paper. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleEffect of Zr/Ti ratios on characterization of Pb(ZrxTi1-x)O-3 thin films on Al2O3 buffered Si for one-transistor memory applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1542901en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume150en_US
dc.citation.issue3en_US
dc.citation.spageG187en_US
dc.citation.epageG191en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000181093600061-
dc.citation.woscount1-
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